Template:AMD Ryzen AI Mobile 400 series

Common features of Ryzen AI 400 notebook APUs:

  • Socket: BGA, FP8 package type.
  • All models support DDR5-5600 or LPDDR5X-8000 (LPDDR5X-8533 for 440, 450, 465, 470, 475 series) in dual-channel mode.
  • All models support 16 PCIe 4.0 lanes.
  • Native USB 40Gbps (USB4) Ports: 2
  • Native USB 10Gbps (USB 3.2 Gen 2 operation mode) Ports: 2
  • iGPU uses the RDNA 3.5 microarchitecture.
  • NPU uses the XDNA 2 AI Engine (Ryzen AI).
  • Both Zen 5 and Zen 5c cores support AVX-512 using a half-width 256-bit FPU.
  • L1 cache: 80 KB (48 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • Fabrication process: TSMC N4P FinFET.
Branding and model CPU GPU NPU
(Ryzen AI)
TDP Release
date
Cores (threads) Clock (GHz) L3 cache
(total)
Model Clock
(GHz)
Total Zen 5 Zen 5c Base Boost
(Zen 5)
Boost
(Zen 5c)
Ryzen AI 9 (PRO)
HX 475
12 (24) 4 (8) 8 (16) 2.0 5.2 3.3 24 MB 890M
16 CUs
3.1 60 TOPS 15–54 W January 5, 2026
(PRO)
HX 470
55 TOPS
(PRO)
465[a]
10 (20) 6 (12) 5.0 880M
12 CUs
2.9 50 TOPS
Ryzen AI 7 (PRO)
450[a]
8 (16) 4 (8) 4 (8) 5.1 3.6 16 MB 860M
8 CUs
3.1
445[a] 6 (12) 2 (4) 4.6 3.5 8 MB 840M
4 CUs
2.9
Ryzen AI 5 PRO 440[a] 3 (6) 3 (6) 4.8 16 MB
(PRO)
435[a]
2 (4) 4 (8) 4.5 3.4 8 MB 2.8
430 4 (8) 1 (2) 3 (6) 15–28 W
  1. 1 2 3 4 5 Model also available as "H" version as H 430, H 435, H PRO 435, H PRO 440, H 445, H PRO 445, H 450, H PRO 450, H 465, and H PRO 465, but lacks support for AMD EXPO and FreeSync technologies.